Details about 2016 lollapalooza 3d collectible credential hologram laminate commemorative pass.
Wearable 3d commemorative laminate.
14 95 4 00 shipping.
How is 3d lamination different from high pressure lamination.
Unlike a standard fbga second level interconnect is achieved on the lga by connecting lands on the package directly onto the pcb through solder re flow.
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2013 lollapalooza 3d collectible credential hologram laminate commemorative pass.
Flga is also available in stacked configurations.
3d lamination can be fabricated into contoured and creatively shaped surfaces while eliminating edgebanding t moldings and visible seams.
See more ideas about projects laminators crafts.
3m scotchgard graphic and surface protection film 8991.
The fine pitch land grid array package is a laminate substrate based package with plastic overmolded encapsulation.
3dl can also be used in 2dl applications such as profile wrapping and flat lamination.
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3d laminates decorative panels 3dls are primarily made of polyvinyl chloride pvc and polyester pet films.